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    <title>Sputtering Equipment Target Company【UCSM Technology Corp.】Sputtering process processing</title>
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    <description>UCSM Technology Corp. has repeatedly planned and implemented thin-film solar sputtering equipment, passive component coating equipment, PCB sputtering copper foundry, and &amp;#34;anti-electromagnetic wave coating&amp;#34; and &amp;#34;surface decoration coating&amp;#34; whole plant output, and low-temperature continuous sputtering equipment produced. Generally, the traditional sputtering equipment system deposits multiple compounds or alloy materials, and often the materials must be re-allocated to form multiple sputtering targets.</description>
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      <title>Sputtering Equipment Target Company【UCSM Technology Corp.】Sputtering process processing</title>
      <description>UCSM Technology Corp. has repeatedly planned and implemented thin-film solar sputtering equipment, passive component coating equipment, PCB sputtering copper foundry, and &amp;#34;anti-electromagnetic wave coating&amp;#34; and &amp;#34;surface decoration coating&amp;#34; whole plant output, and low-temperature continuous sputtering equipment produced. Generally, the traditional sputtering equipment system deposits multiple compounds or alloy materials, and often the materials must be re-allocated to form multiple sputtering targets.</description>
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      <title>Sputtering Equipment Target Company【UCSM Technology Corp.】Sputtering process processing</title>
      <description>UCSM Technology Corp. has repeatedly planned and implemented thin-film solar sputtering equipment, passive component coating equipment, PCB sputtering copper foundry, and &amp;#34;anti-electromagnetic wave coating&amp;#34; and &amp;#34;surface decoration coating&amp;#34; whole plant output, and low-temperature continuous sputtering equipment produced. Generally, the traditional sputtering equipment system deposits multiple compounds or alloy materials, and often the materials must be re-allocated to form multiple sputtering targets.</description>
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      <title>About Us-Sputtering Equipment Target Company【UCSM Technology Corp.】Sputtering process processing</title>
      <description>About Us</description>
      <pubDate>Wed, 10 Jun 2026 08:30:20 +0800</pubDate>
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      <title>Our story-Sputtering Equipment Target Company【UCSM Technology Corp.】Sputtering process processing</title>
      <description>We are a technology company dedicated to providing solutions for sputtering targets and sputtering technical problems. Our equipment are used to solv</description>
      <pubDate>Mon, 08 May 2023 11:22:19 +0800</pubDate>
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      <title>Our team-Sputtering Equipment Target Company【UCSM Technology Corp.】Sputtering process processing</title>
      <description>Founder Chairman LUO SHANG XIAN Co-founder and general manager CAI MENG HONG  Equipment development team ZHONG SONG MING Equipment development t</description>
      <pubDate>Thu, 20 May 2021 09:27:05 +0800</pubDate>
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      <title>Core Business</title>
      <description>UCSM Technology Corp. has repeatedly planned and implemented thin-film solar sputtering equipment, passive component coating equipment, PCB sputtering copper foundry, and &amp;#34;anti-electromagnetic wave coating&amp;#34; and &amp;#34;surface decoration coating&amp;#34; whole plant output, and low-temperature continuous sputtering equipment produced. Generally, the traditional sputtering equipment system deposits multiple compounds or alloy materials, and often the materials must be re-allocated to form multiple sputtering targets.</description>
      <pubDate>Mon, 08 May 2023 18:14:55 +0800</pubDate>
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      <title>Technical Service</title>
      <description>Technical Service</description>
      <pubDate>Wed, 10 Jun 2026 08:30:20 +0800</pubDate>
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      <title>Alloy thin film development</title>
      <description>Collaborative Development of Thin Film Alloys Do you have great ideas or a need for alloy thin films, but struggle with the high cost of developing th</description>
      <pubDate>Mon, 08 May 2023 18:19:46 +0800</pubDate>
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      <title>Coating OEM</title>
      <description>The most cost-effective coating equipment for development Do you have great ideas and demands for alloy thin films, but are struggling with the high c</description>
      <pubDate>Mon, 08 May 2023 18:16:31 +0800</pubDate>
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      <title>Thin film thickness and component XRF analysis</title>
      <description>Film XRF Thickness and Composition Analysis Service X-ray fluorescence spectroscopy (XRF) is a non-destructive chemical analysis technique that can qu</description>
      <pubDate>Mon, 08 May 2023 17:07:18 +0800</pubDate>
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      <title>Sputtering source repair and maintenance</title>
      <description>Sputtering Source Maintenance Service UCSM Technology is a highly specialized company in the field of sputtering. We provide customers with high-quali</description>
      <pubDate>Mon, 08 May 2023 18:18:56 +0800</pubDate>
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      <title>Sputtering Target Characterization service-Sputtering Equipment Target Company【UCSM Technology Corp.】Sputtering process processi</title>
      <description>Sputtering Target Characterization, test items: ● Appearance Inspection of the sputtering surface of the target ● The number of particles and the num</description>
      <pubDate>Mon, 08 May 2023 18:22:17 +0800</pubDate>
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      <title>Ultra Clean Surface Machining service-Sputtering Equipment Target Company【UCSM Technology Corp.】Sputtering process processing</title>
      <description>We will use a high-density plasma source to remove ● Processing damage ● Particals residue ● Surface heterogeneous pollution ● Surface oxidation Afte</description>
      <pubDate>Mon, 08 May 2023 18:24:15 +0800</pubDate>
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      <title>Technology-Sputtering Equipment Target Company【UCSM Technology Corp.】Sputtering process processing</title>
      <description>Technology</description>
      <pubDate>Wed, 10 Jun 2026 08:30:20 +0800</pubDate>
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      <title>Ultra Clean Surface Machining-Sputtering Equipment Target Company【UCSM Technology Corp.】Sputtering process processing</title>
      <description>We will use a high-density plasma source to remove ● Processing damage ● Particals residue ● Surface heterogeneous pollution ● Surface oxidation Afte</description>
      <pubDate>Mon, 08 May 2023 18:25:08 +0800</pubDate>
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      <title>Sputtering Target Characterization-Sputtering Equipment Target Company【UCSM Technology Corp.】Sputtering process processing</title>
      <description>We have developed a set of target sputtering detection technology to provide analysis of target sputtering behavior, greatly accelerate the target de</description>
      <pubDate>Mon, 08 May 2023 18:26:51 +0800</pubDate>
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      <title>Co-Sputtering System for Alloy Film Development</title>
      <description>Alloy Thin Film Co-Sputtering System UCSM Technology has developed a co-sputtering system that has a proven track record in commissioned thin film man</description>
      <pubDate>Mon, 08 May 2023 11:34:57 +0800</pubDate>
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      <title>Sputtering Cathode_SC Series</title>
      <description>Self-developed sputtering source by UCSM Technology UCSM Technology is a company specializing in the research and development of sputtering technology</description>
      <pubDate>Mon, 08 May 2023 12:07:33 +0800</pubDate>
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      <title>Sputtering Cathode_SCR Series</title>
      <description>Self-developed sputtering source by UCSM Technology UCSM Technology is a company specializing in sputtering technology research and product developmen</description>
      <pubDate>Mon, 08 May 2023 12:08:05 +0800</pubDate>
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      <title>Products</title>
      <description>Products</description>
      <pubDate>Wed, 10 Jun 2026 08:30:20 +0800</pubDate>
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      <title>Cooperation-Sputtering Equipment Target Company【UCSM Technology Corp.】Sputtering process processing</title>
      <description>Cooperation</description>
      <pubDate>Wed, 10 Jun 2026 08:30:20 +0800</pubDate>
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      <title>Cooperation-Sputtering Equipment Target Company【UCSM Technology Corp.】Sputtering process processing</title>
      <description>01 Accelerate innovation 02 New venture cooperation 03 Academic plan 04 Corporate and government projects 05 Technology authorization</description>
      <pubDate>Mon, 08 May 2023 18:28:44 +0800</pubDate>
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      <title>COOPERATION CUSTOMER</title>
      <description>COOPERATION CUSTOMER</description>
      <pubDate>Wed, 10 Jun 2026 08:30:20 +0800</pubDate>
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      <title>COOPERATION CUSTOMER</title>
      <description>UCSM Technology Corp. has repeatedly planned and implemented thin-film solar sputtering equipment, passive component coating equipment, PCB sputtering copper foundry, and &amp;#34;anti-electromagnetic wave coating&amp;#34; and &amp;#34;surface decoration coating&amp;#34; whole plant output, and low-temperature continuous sputtering equipment produced. Generally, the traditional sputtering equipment system deposits multiple compounds or alloy materials, and often the materials must be re-allocated to form multiple sputtering targets.</description>
      <pubDate>Mon, 08 May 2023 18:32:46 +0800</pubDate>
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      <title>Sputtering Equipment Target Company【UCSM Technology Corp.】Sputtering process processing</title>
      <description>UCSM Technology Corp. has repeatedly planned and implemented thin-film solar sputtering equipment, passive component coating equipment, PCB sputtering copper foundry, and &amp;#34;anti-electromagnetic wave coating&amp;#34; and &amp;#34;surface decoration coating&amp;#34; whole plant output, and low-temperature continuous sputtering equipment produced. Generally, the traditional sputtering equipment system deposits multiple compounds or alloy materials, and often the materials must be re-allocated to form multiple sputtering targets.</description>
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      <title>Latest news-Sputtering Equipment Target Company【UCSM Technology Corp.】Sputtering process processing</title>
      <description>Latest news</description>
      <pubDate>Wed, 10 Jun 2026 08:30:20 +0800</pubDate>
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      <title>109 Annual Local SBIR Project won the Excellent Manufacturer Award and recommended to apply for the Central SBIR Project-Sputtering Equipment Target Company【UCSM Technology Corp.】Sputtering process processing</title>
      <description>In 108, it applied for Tainan&amp;#39;s local SBIR plan and passed it. The first product of Jianwei Company is an innovative Ultra Clean Surface Machining</description>
      <pubDate>Mon, 26 Apr 2021 08:47:33 +0800</pubDate>
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      <title>UCSM Specializing in plasma equipment and coating technology-Sputtering Equipment Target Company【UCSM Technology Corp.】Sputtering process processing</title>
      <description>We use a high-density plasma source to remove the target&amp;#39;s surface damage caused by traditional processing, pollution and surface oxidation proble</description>
      <pubDate>Mon, 22 Mar 2021 15:37:13 +0800</pubDate>
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      <title>Cross the industry&amp;#39;s plasma processing limit-Sputtering Equipment Target Company【UCSM Technology Corp.】Sputtering process processing</title>
      <description>With its superior plasma process and equipment development capabilities, it has successively entered the supply chain of American semiconductor, mobil</description>
      <pubDate>Mon, 22 Mar 2021 14:59:43 +0800</pubDate>
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      <title>Sputtering Equipment Target Company【UCSM Technology Corp.】Sputtering process processing</title>
      <description>UCSM Technology Corp. has repeatedly planned and implemented thin-film solar sputtering equipment, passive component coating equipment, PCB sputtering copper foundry, and &amp;#34;anti-electromagnetic wave coating&amp;#34; and &amp;#34;surface decoration coating&amp;#34; whole plant output, and low-temperature continuous sputtering equipment produced. Generally, the traditional sputtering equipment system deposits multiple compounds or alloy materials, and often the materials must be re-allocated to form multiple sputtering targets.</description>
      <pubDate>Wed, 10 Jun 2026 08:30:20 +0800</pubDate>
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      <title>Sputtering Equipment Target Company【UCSM Technology Corp.】Sputtering process processing</title>
      <description>UCSM Technology Corp. has repeatedly planned and implemented thin-film solar sputtering equipment, passive component coating equipment, PCB sputtering copper foundry, and &amp;#34;anti-electromagnetic wave coating&amp;#34; and &amp;#34;surface decoration coating&amp;#34; whole plant output, and low-temperature continuous sputtering equipment produced. Generally, the traditional sputtering equipment system deposits multiple compounds or alloy materials, and often the materials must be re-allocated to form multiple sputtering targets.</description>
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      <title>Sputtering Equipment Target Company【UCSM Technology Corp.】Sputtering process processing</title>
      <description>UCSM Technology Corp. has repeatedly planned and implemented thin-film solar sputtering equipment, passive component coating equipment, PCB sputtering copper foundry, and &amp;#34;anti-electromagnetic wave coating&amp;#34; and &amp;#34;surface decoration coating&amp;#34; whole plant output, and low-temperature continuous sputtering equipment produced. Generally, the traditional sputtering equipment system deposits multiple compounds or alloy materials, and often the materials must be re-allocated to form multiple sputtering targets.</description>
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      <title>Sputtering Equipment Target Company【UCSM Technology Corp.】Sputtering process processing</title>
      <description>UCSM Technology Corp. has repeatedly planned and implemented thin-film solar sputtering equipment, passive component coating equipment, PCB sputtering copper foundry, and &amp;#34;anti-electromagnetic wave coating&amp;#34; and &amp;#34;surface decoration coating&amp;#34; whole plant output, and low-temperature continuous sputtering equipment produced. Generally, the traditional sputtering equipment system deposits multiple compounds or alloy materials, and often the materials must be re-allocated to form multiple sputtering targets.</description>
      <pubDate>Mon, 08 May 2023 18:44:21 +0800</pubDate>
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