Customized omni-directional target testing equipment

UCSM Technology Corp.

Sputtering Equipment Target Company【UCSM Technolog

Customized omni-directional target testing equipment

Customized omni-directional target testing equipment

Special equipment for sputtering target omni-directional target detection, providing customized design, production and service according to the different needs of clients.

This equipment enables the target supplier to target the sputtering characteristics that target users care about, including:

  • Appearance Inspection of the sputtering surface of the target

  • The number of particles and the number of abnormal discharge behaviors of plasma 

  • Sputtering current and voltage characteristic curve

  • Target sputtering/film uniformity 

  • Target utilization rate 

  • Target scattering angle 

  • Thin film characteristics

Carry out verification, and accelerate the research and development speed of R&D target materials and the ability to communicate with customers.

  • The equipment that can handle different target size ranges can be designed according to requirements.

  • The special machine design can carry out omni-directional target detection for the target.

  • Corresponding functions can be customized according to the special needs of users.

  • PC based operation interface, equipped with data collection capability, easy to operate.

Other information

  • Tax ID number 64899661




Company Information

  • ADD:No.31, Gongye 2nd Rd., Annan Dist., Tainan City 709410, Taiwan (R.O.C.) R2107
  • TEL:+886-6-3842805
  • MOB:
  • FAX:
  • Tax ID number:64899661

©Copyright All Rights Reserved UCSM Technology Crop.

Design By : Apple Web Design
The sputtering target material provides good film characteristics and sputtering process efficiency, which helps to control the quality of the disc. In addition, the sputtering equipment's cleanliness, crystal image uniformity and recycling system for sputtering targets, as well as related integrated technology and quality services. Different sputtering equipment power supplies can provide different deposition methods and process speeds.