Sputtering target company-providing sputtering equ

UCSM Technology Corp.

UCSMTechnology Corp.

Allow customers to gain a leading position in the industry

We are a technology company dedicated to providing solutions for sputtering targets and sputtering technical problems. Our equipment are used to solve the problems of dirt and particles on the surface of the target, and improve the product yield of target users. We have a specialty in target materials and sputtering, which can provide target manufacturers and target users to accelerate research and development, promote product innovation, and generate value.

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Top quality in the industry

Provide professional-level customized integrated solutions

UCSM Technology Corp. develops various plasma equipment and provides solutions to various plasma-related engineering problems. Our innovative technology allows customers to gain a leading position in the industry.

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109 Annual Local SBIR Project won the Excellent Manufacturer Award and recommended to apply for the Central SBIR Project

26Apr

109 Annual Local SBIR Project won the Excellent Manufacturer Award and recommended to apply for the Central SBIR Project

In 108, it applied for Tainan's local SBIR plan and passed it. The first product of Jianwei Company is an innovative Ultra Clean Surface Machining (UCSM), which uses non-contacting target surface The target surface is processed by sputtering bombardment to obtain a clean target surface. The machine with this original technology is completely developed and designed by See Weike. It is looking for a local processing factory in Tainan to assist in the development and production of the machine. And cooperated with Taiwan's leader in the target industry, Koyo Applied Materials Co.,
UCSM Specializing in plasma equipment and coating technology

22Mar

UCSM Specializing in plasma equipment and coating technology

We use a high-density plasma source to remove the target's surface damage caused by traditional processing, pollution and surface oxidation problems caused by cleaning. UCSM can provide ultra-clean target surface characteristics of the target material, which helps target users, shortens the pre-sputtering time, reduces the abnormal discharge behavior of the target during the sputtering process (Arcing), and improves the adhesion of the target back splash The ability to ultimately reduce the particle issues (Particles issues) generated during the sputtering process of the ta
Cross the industry's plasma processing limit

22Mar

Cross the industry's plasma processing limit

With its superior plasma process and equipment development capabilities, it has successively entered the supply chain of American semiconductor, mobile device and communications manufacturers. At the same time, after establishing agency cooperation and market development technology platforms, in recent years, it has continuously obtained several Japanese flexible printing companies. Orders from major manufacturers of circuit boards and IC substrates are attractive in terms of revenue.

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Company Information

  • ADD：No.31, Gongye 2nd Rd., Annan Dist., Tainan City 709410, Taiwan (R.O.C.) R3101
  • TEL：+886-6-3842805
  • MOB：
  • FAX：
  • EMAIL：ucsm@ucsm.com.tw
  • Tax ID number：64899661

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The sputtering target material provides good film characteristics and sputtering process efficiency, which helps to control the quality of the disc. In addition, the sputtering equipment's cleanliness, crystal image uniformity and recycling system for sputtering targets, as well as related integrated technology and quality services. Different sputtering equipment power supplies can provide different deposition methods and process speeds.