Co-Sputtering System for Alloy Film Development

UCSM Technology Corp.

Co-Sputtering System for Alloy Film Development

Alloy Thin Film Co-Sputtering System

UCSM Technology has developed a co-sputtering system that has a proven track record in commissioned thin film manufacturing and alloy development. We are now launching this product, which is highly suitable for research institutions to develop diverse alloy thin films and multi-layer film stacks to meet the needs of different research fields.Our equipment has several advantages:

Fully automated

UCSM Technology's co-sputtering system can achieve fully automated thin film sputtering, reducing personnel operation time and simplifying tedious vacuum process operations.

Equipment self-protection mechanism

The operating system developed by SeeMicro Technology also has a comprehensive machine self-protection process, which can prevent personnel from damaging the equipment due to accidental operations, improving the reliability and stability of the machine.

Large uniform film area

This co-sputtering system uses 2-inch or 3-inch targets to obtain a uniform film area (Sigma% <2%) with a diameter of more than 4 inches, significantly reducing the cost of target materials invested in development.

UCSM Technology's co-sputtering system has unique advantages and innovation in the field of thin film sputtering technology. The system can not only meet the needs of research institutions for diverse alloy thin films and multi-layer films but also achieve fully automated thin film sputtering, improving research efficiency and quality. We believe that SeeMicro Technology's co-sputtering system will become a new standard in thin film sputtering technology, bringing more development opportunities to research institutions and the industry.

Software User Interface (UI)

Equipment Specifications (Customizable)




Company Information

  • ADD:No.31, Gongye 2nd Rd., Annan Dist., Tainan City 709410, Taiwan (R.O.C.) R3101
  • TEL:+886-6-3842805
  • MOB:
  • FAX:
  • Tax ID number:64899661

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The sputtering target material provides good film characteristics and sputtering process efficiency, which helps to control the quality of the disc. In addition, the sputtering equipment's cleanliness, crystal image uniformity and recycling system for sputtering targets, as well as related integrated technology and quality services. Different sputtering equipment power supplies can provide different deposition methods and process speeds.