Sputtering Cathode_SCR Series

UCSM Technology Corp.

Sputtering Cathode_SCR Series

Self-developed sputtering source by UCSM Technology
UCSM Technology is a company specializing in sputtering technology research and product development. We are committed to providing the highest quality sputtering sources and related equipment to promote the development of thin film applications. Today, we are very honored to promote our self-developed sputtering source products to you. Here are some product features and advantages:

Excellent heat dissipation:
We know that most research institutions often have trouble with sputtering source heat dissipation, which often leads to target dropping and cracking problems. UCSM Technology pays special attention to the heat dissipation design of sputtering sources to effectively solve the heat dissipation problem of small sputtering sources.

Multiple models:
Our sputtering source products have multiple sizes and specifications to meet the needs of different equipment.

High stability:
Our sputtering source products have excellent stability and reliability, ensuring the stability and product quality of the production process.

High customization:
Many equipment is difficult to find replacement products due to sputtering source damage, often becoming equipment orphans. This problem can be entrusted to Jianwei. Our sputtering source products are all self-designed and can be discussed with customers to design sputtering sources that meet existing systems.

UCSM Technology's self-developed sputtering source products have been widely recognized and praised by customers. We believe that UCSM Technology's sputtering source products will bring higher efficiency and quality to your research and development process, and bring more opportunities for your enterprise development.

SCR Series

UCSM Technology's SCR series sputtering source is very suitable for product research and mass production. The SCR is designed and adjusted according to different sputtering materials to make the target material have a high yield. The SCR series sputtering source can achieve good film uniformity at a shorter sputtering distance (TS). The magnet can be chosen without immersion in water according to the requirements of the target material, greatly improving the magnet's lifespan. The excellent cooling capacity of the sputtering source avoids the problem of temperature accumulation during target material sputtering. The magnet's high speed can reach ≥ 180rpm, which can sputter thinner and more uniform films.


Specification Table




Company Information

  • ADD:No.31, Gongye 2nd Rd., Annan Dist., Tainan City 709410, Taiwan (R.O.C.) R3101
  • TEL:+886-6-3842805
  • MOB:
  • FAX:
  • EMAIL:ucsm@ucsm.com.tw
  • Tax ID number:64899661

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The sputtering target material provides good film characteristics and sputtering process efficiency, which helps to control the quality of the disc. In addition, the sputtering equipment's cleanliness, crystal image uniformity and recycling system for sputtering targets, as well as related integrated technology and quality services. Different sputtering equipment power supplies can provide different deposition methods and process speeds.