Ultra Clean Surface Machining-Sputtering Equipment Target Company【UCSM Technology Corp.】Sputtering process processing

UCSM Technology Corp.

Sputtering Equipment Target Company【UCSM Technolog

Ultra Clean Surface Machining

We will use a high-density plasma source to remove

  • Processing damage

  • Particals residue

  • Surface heterogeneous pollution

  • Surface oxidation

After this process, we can help target users to

  • Significantly shorten the pre-sputtering time

  • Reduce abnormal discharge behavior during sputtering (Arcing)

  • Slow down the oxidation of the target material

  • And significantly improve the adhesion of the target back splash

Finally reduce the particles issue generated in the sputtering process of the target material, thereby improving the product yield.

Other information

  • Tax ID number 64899661

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Company Information

  • ADD:No.31, Gongye 2nd Rd., Annan Dist., Tainan City 709410, Taiwan (R.O.C.) R2107
  • TEL:+886-6-3842805
  • MOB:
  • FAX:
  • EMAIL:ucsm.tech@gmail.com
  • Tax ID number:64899661

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The sputtering target material provides good film characteristics and sputtering process efficiency, which helps to control the quality of the disc. In addition, the sputtering equipment's cleanliness, crystal image uniformity and recycling system for sputtering targets, as well as related integrated technology and quality services. Different sputtering equipment power supplies can provide different deposition methods and process speeds.