Sputtering Cathode_SC Series

UCSM Technology Corp.

Sputtering Cathode_SC Series

Self-developed sputtering source by UCSM Technology

UCSM Technology is a company specializing in the research and development of sputtering technology and products. We are committed to providing the highest quality sputtering sources and related equipment to promote the development of the thin film application field. Today, we are very honored to promote our self-developed sputtering source products to you. Here are some product features and advantages:

Excellent heat dissipation:
We know that many research units often suffer from the problem of sputtering source heat dissipation, which often leads to target dropping and cracking problems. UCSM Technology pays special attention to the heat dissipation design of sputtering sources, effectively solving the heat dissipation problems of small sputtering sources.

Multiple models:
Our sputtering source products come in various sizes and specifications to meet the needs of different equipment.

High stability:
Our sputtering source products have excellent stability and reliability, ensuring production stability and product quality.

Many equipment cannot find alternative products due to sputtering source damage, often becoming equipment orphans. This problem can be solved by UCSM Technology. Our sputtering source products are self-designed and can be discussed with customers to design sputtering sources that fit existing systems.

UCSM Technology's self-developed sputtering source products have been widely recognized and praised by customers. We believe that UCSM Technology's sputtering source products will bring higher efficiency and quality to your research and development process, and bring more opportunities for your company's development.

SC Series

UCSM Technology's SC series small sputtering source is very suitable for academic research and product development.
Excellent sputtering source cooling capacity to avoid temperature accumulation during target sputtering.
The magnet does not need to be immersed in water, significantly improving the magnet's lifespan.
Simple and easy target replacement method and flexible target thickness selection (1-9mm).
The SC series small sputtering source can be adjusted ±45° for sputtering source angle.
The SC series small sputtering source can be used with DC, Pulsed DC, RF, HiPIMS power supplies, suitable for various application developments.


Specification Table




Company Information

  • ADD:No.31, Gongye 2nd Rd., Annan Dist., Tainan City 709410, Taiwan (R.O.C.) R3101
  • TEL:+886-6-3842805
  • MOB:
  • FAX:
  • EMAIL:ucsm@ucsm.com.tw
  • Tax ID number:64899661

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The sputtering target material provides good film characteristics and sputtering process efficiency, which helps to control the quality of the disc. In addition, the sputtering equipment's cleanliness, crystal image uniformity and recycling system for sputtering targets, as well as related integrated technology and quality services. Different sputtering equipment power supplies can provide different deposition methods and process speeds.