Articles Technology
Sputtering Target Characterization
We have developed a set of target sputtering detection technology to provide analysis of target sputtering behavior, greatly accelerate the target development cycle and provide detection indicators of target sputtering characteristics.
Traditional target detection is the basic physical characteristics of the target, such as:
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Flexural strength
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Microstructure inspection
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Electrical testing
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Purity and impurities
However, these characteristics cannot directly connect the sputtering performance that target users are interested in. The STC technology developed by us can simulate the sputtering conditions of various sputtering industries
contain:
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Appearance Inspection of the sputtering surface of the target
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The number of particles and the number of abnormal discharge behaviors of plasma
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Sputtering current and voltage characteristic curve
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Target sputtering/film uniformity
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Target utilization rate
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Target scattering angle
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Thin film characteristics
It allows target suppliers to provide the sputtering characteristics data that downstream sputter company really care about, establish target quality control, and greatly shorten the cycle time for target research and development verification.
