We are a technology company dedicated to providing solutions for sputtering targets and sputtering technical problems. Our equipment are used to solve the problems of dirt and particles on the surface of the target, and improve the product yield of target users. We have a specialty in target materials and sputtering, which can provide target manufacturers and target users to accelerate research and development, promote product innovation, and generate value.
We use plasma technology to achieve various plasma applications. UCSM Technology Crop since its establishment, and gradually expand the possible applications of plasma. For example, Ultra Clean Surface Machining (UCSM),Sputtering Target Characterization, (STC).
UCSM Technology Crop develops various plasma equipment and provides solutions to various plasma-related engineering problems. Our innovative technology allows customers to gain a leading position in the industry:
●Ultra-clean target surface, providing a better target sputtering experience, such as low Particles, excellent sputtering ability.
●From the basic physical properties of the previous target materials, to the advanced stage, each target material can be shipped with sputtering characteristics, such as: sputtering voltage, sputtering current, Arcing performance, target sputtering uniformity... etc.
●We provide many innovative ideas and cooperate with our partners to break through the existing framework and enhance the value of products or technologies.