UCSM Specializing in plasma equipment and coating technology-Sputtering Equipment Target Company【UCSM Technology Corp.】Sputtering process processing

We use a high-density plasma source to remove the target's surface damage caused by traditional processing, pollution and surface oxidation problems caused by cleaning. UCSM can provide ultra-clean target surface characteristics of the target material, which helps target users, shortens the pre-sputtering time, reduces the abnormal discharge behavior of the target during the sputtering process (Arcing), and improves the adhesion of the target back splash The ability to ultimately reduce the particle issues (Particles issues) generated during the sputtering process of the target material, and improve the product yield.

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109 Annual Local SBIR Project won the Excellent Manufacturer Award and recommended to apply for the Central SBIR Project

Cross the industry's plasma processing limit